UV559 MECHANIC Soldering Flux Paste UV559 No Clean BGA Solder Ball Repair Welding Paste For Phone PCB PGA SMD Rework
SKU: 637736248524561702
Rosin flux is used to facilitate soldering. PCB Soldering Paste cleans and prevents metal oxidation which allows the solder to create strong, long-lasting mechanical and electrical bonds. Welding Flux also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process. This rosin soldering flux paste is the best for IC and PCB for no corrosive. Mechanic Flux Paste has a high bond strength and PH value-neutral. Solder Gel is also applicable for mobile phones, PC cards, and other sophisticated electronic chip-level welding.
Features And Specifications Of High synthetic BGA PCB PGA SMD Solder Flux Paste:
- Flux Type: UV-559
- Volume: 10ml/10cc
- Dimension: 93 x 33 x 23mm
- Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
- Insulated: Yes
- Application: for soldering and reballing of computer and phone chips.
- Advantage: Good immersion and high-intensity joint.
- Function: for PCB, BGA, PGA reworking.
- 100%: New Type, high quality.
Package Include:
- 1 x MECHANIC Soldering Flux Paste UV559
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